书目详细信息
： Modeling and application of flexible electronics packaging =
书目信息 机读格式(MARC)
| ISBN： | 978-7-03-062505-2 |
|---|---|
| 编目源： | TJU TJU |
| 个人名称： | Huang, YongAn, |
| 题名： | Modeling and application of flexible electronics packaging = 柔性电子封装工艺建模与应用 / YongAn Huang, Zhouping Yin, Xiaodong Wan. |
| 出版发行项： | Beijing : Singapore : Science Press ; Springer, [2019] |
| 载体形态： | xiii, 287 pages : illustrations ; 25 cm |
| 书目附注： | Includes bibliographical references. |
| 格式化内容附注： | Advanced Electronics Packaging -- Interfacial Modeling of Flexible Multilayer Structures -- Measurement of Strength of Ultra-Thin Silicon Chip and Interfacial Fracture Energy -- Shear-Assisted Peeling -- Single-Needle Peeling -- Multi-Needle Peeling -- Conformal Peeling -- Laser Lift-Off -- Vacuum-Based Picking-up and Placing-on. |